Patent Assignment
Reel/Frame 062899/0770
Assignment of Assignor's Interest
Recorded: 2023-03-07
Pages: 2
Assignor
TSAI, WEN-CHIEH
Executed: 2023-02-15
Assignee
WINBOND ELECTRONICS CORP.
NO. 8 KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK, TAICHUNG CITY, TAIWAN
Covered Property
(1)
Semiconductor Structure and Method for Forming the Same