Patent Assignment
Reel/Frame 062907/0188
Assignment of Assignor's Interest
Recorded: 2023-03-07
Pages: 3
Assignors
LEE, SEUNG HWAN
Executed: 2023-01-26
LIM, CHUL TACK
Executed: 2023-01-30
CHO, HAN EOL
Executed: 2023-01-26
KIM, YE RIN
Executed: 2023-01-26
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Electronic Component