Patent Assignment
Reel/Frame 062908/0498
Assignment of Assignor's Interest
Recorded: 2023-03-07
Pages: 3
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board Including Bonding Layer, Having Conductive Particles, Disposed Between Core Portions