Patent Assignment
Reel/Frame 062925/0423
Assignment of Assignor's Interest
Recorded: 2023-03-08
Pages: 6
Assignors
CHANG, CHENG-WEI
Executed: 2023-02-06
MORE, SHAHAJI B.
Executed: 2023-02-08
CHOU, CHI-YU
Executed: 2022-09-19
PAI, YUEH-CHING
Executed: 2022-09-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Devices and Methods of Fabrication Thereof