Patent Assignment
Reel/Frame 062934/0872
Assignment of Assignor's Interest
Recorded: 2023-03-09
Pages: 8
Assignors
CHIA, GEEMAY
Executed: 2023-03-03
HAYASHI, SATOSHI
Executed: 2023-03-06
NAKAURA, SO
Executed: 2023-03-06
LEE, JU-CHIA
Executed: 2023-03-03
Assignee
HONDA MOTOR CO., LTD.
1-1, MINAMI-AOYAMA 2-CHOME, MINATO-KU, TOKYO, 107-8556, JAPAN
Covered Property
(1)
Wrap Device for Modular Panel System and Wrapping Method