Patent Assignment
Reel/Frame 062936/0426
Assignment of Assignor's Interest
Recorded: 2023-03-09
Pages: 4
Assignors
CHUANG, HARRY-HAKLAY
Executed: 2022-09-28
WU, WEI CHENG
Executed: 2022-09-11
HUANG, CHUNG-JEN
Executed: 2022-09-11
HUANG, WEN-TUO
Executed: 2022-09-11
LIN, CHIA-SHENG
Executed: 2022-09-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Redistribution Layer Metallic Structure and Method
Application:
18/181,293 →
Publication:
US 2023/0377968