Patent Assignment
Reel/Frame 062951/0094
Assignment of Assignor's Interest
Recorded: 2023-03-10
Pages: 7
Assignors
LEE, JIN-KYUN
Executed: 2023-01-16
KOH, CHAWON
Executed: 2022-12-26
KU, YE-JIN
Executed: 2023-01-13
NISHI, TSUNEHIRO
Executed: 2022-12-30
KIM, HYUNWOO
Executed: 2022-12-26
AHN, HYUNG-JU
Executed: 2023-01-13
Assignees
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
INHA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
253 YONGHYUN-DONG, NAM-GU, INCHEON, KOREA, REPUBLIC OF
Covered Property
(1)
Organometallic Compound Comprising a Metal Combined with at Least One Ligand Containing Four or More Fluorine Atoms, Resist Composition Comprising the Same, and Method of Fabricating Semiconductor Device Using the Same
Application:
18/120,248 →
Publication:
US 2023/0400764