Patent Assignment
Reel/Frame 062952/0431
Assignment of Assignor's Interest
Recorded: 2023-03-10
Pages: 4
Assignors
HSU, WU CHOU
Executed: 2023-03-01
CHUANG, HUNG YI
Executed: 2023-03-01
TARNG, SHIN-LUH
Executed: 2023-03-01
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANZIH DIST., KAOHSIUNG, 811, TAIWAN
Covered Property
(1)
Package Structure and Method of Manufacturing the Same