IP Library Assignment 062956/0916
Patent Assignment
Reel/Frame 062956/0916

Change of Name

Recorded: 2023-03-06 Pages: 11
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Circuit Connection Structure, Method for Producing the Same and Semiconductor Substrate for Circuit Connection Structure
Patent: 8,148,204 →
Application: 12/064,522 →
Publication: US 2009/0189254
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 7, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063275/0556 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →