Patent Assignment
Reel/Frame 063275/0556
Change of Name
Recorded: 2023-03-07
Pages: 11
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Circuit Connection Structure, Method for Producing the Same and Semiconductor Substrate for Circuit Connection Structure
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 7, 2008
From: KANEYA, YUICHI; TANAKA, TOSHIAKI; ITABASHI, TOSHIAKI
To: HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.; HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 020615/0940 →
Change of Name
Mar 6, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062956/0916 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →