Patent Assignment
Reel/Frame 020615/0940
Assignment of Assignor's Interest
Recorded: 2008-03-07
Pages: 3
Assignors
KANEYA, YUICHI
Executed: 2008-02-12
TANAKA, TOSHIAKI
Executed: 2008-02-12
ITABASHI, TOSHIAKI
Executed: 2008-02-12
Assignees
HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
4-1, KOISHIKAWA 1-CHOME, BUNKYOU-KU, TOKYO, 112-0002, JAPAN
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Circuit Connection Structure, Method for Producing the Same and Semiconductor Substrate for Circuit Connection Structure
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 6, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062956/0916 →
Change of Name
Mar 7, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063275/0556 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →