Patent Assignment
Reel/Frame 062959/0120
Assignment of Assignor's Interest
Recorded: 2023-03-13
Pages: 8
Assignors
CHANG, JIE
Executed: 2023-02-22
YUAN, XIAOYING
Executed: 2023-02-22
LEE, KEUNHYUK
Executed: 2023-02-28
TEYSSEYRE, JEROME
Executed: 2023-03-07
GU, LEO
Executed: 2023-03-12
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Discrete Dual Pads for a Circuit
Application:
18/181,950 →
Publication:
US 2024/0304529
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 9, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 065402/0293 →
Release of Security Interest in Patents Recorded at Reel 064502, Frame 0293
Nov 14, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065566/0488 →