Patent Assignment
Reel/Frame 062960/0460
Assignment of Assignor's Interest
Recorded: 2023-03-13
Pages: 7
Assignors
JEON, OSEOB
Executed: 2023-03-13
KANG, DONGWOOK
Executed: 2023-03-13
IM, SEUNGWON
Executed: 2023-03-13
KIM, JIHWAN
Executed: 2023-03-13
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Integrated Substrates and Related Methods
Application:
18/182,552 →
Publication:
US 2024/0120253
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 9, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 065402/0293 →
Release of Security Interest in Patents Recorded at Reel 064502, Frame 0293
Nov 14, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065566/0488 →