Patent Assignment
Reel/Frame 062965/0358
Assignment of Assignor's Interest
Recorded: 2023-03-13
Pages: 4
Assignors
LIANG, SHUEN-SHIN
Executed: 2023-02-24
LIN, KAN-JU
Executed: 2023-02-14
CHU, CHIA-HUNG
Executed: 2023-02-15
CHANG, CHIEN
Executed: 2023-03-10
CHIEN, HARRY
Executed: 2023-02-14
WANG, SUNG-LI
Executed: 2023-02-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method and Device Related to Seamless Metal Contact
Application:
18/182,921 →
Publication:
US 2024/0313075