Patent Assignment
Reel/Frame 062980/0130
Assignment of Assignor's Interest
Recorded: 2023-03-14
Pages: 7
Assignors
HWANG, HYEONJEONG
Executed: 2023-02-16
KIM, DONGWOOK
Executed: 2023-02-16
SUK, KYOUNGLIM
Executed: 2023-02-16
SONG, INHYUNG
Executed: 2023-02-16
JANG, SEHOON
Executed: 2023-02-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same
Application:
18/183,699 →
Publication:
US 2024/0047324