Assignment of Assignor's Interest

Recorded: 2023-03-14 Pages: 7

Assignors

KIM, DONGKYU

Executed: 2023-02-13

KIM, JOONSUNG

Executed: 2023-02-13

LEE, HYEONSEOK

Executed: 2023-02-13

HWANG, HYEONJEONG

Executed: 2023-02-13

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF

Covered Property (1)

Semiconductor Package Including a Semiconductor Chip on a Redistribution Substrate and Conductive Structure Spaced Apart from the Semiconductor Chip

Application: 18/121,429 →

Publication: US 2024/0038642