Patent Assignment
Reel/Frame 062983/0276
Assignment of Assignor's Interest
Recorded: 2023-03-15
Pages: 6
Assignee
CHANGXIN MEMORY TECHNOLOGIES, INC.
NO. 388, XINGYE AVENUE, AIRPORT INDUSTRIAL PARK, ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA, HEFEI, ANHUI, 230601, CHINA
Covered Property
(1)
Semiconductor Package Structure and Manufacturing Method Therefor
Application:
18/169,295 →
Publication:
US 2024/0055420