Patent Assignment
Reel/Frame 062986/0173
Assignment of Assignor's Interest
Recorded: 2023-03-15
Pages: 4
Assignors
KAO, WAN-YI
Executed: 2023-01-10
WANG, CHUNYAO
Executed: 2023-01-10
LU, YUNG-CHENG
Executed: 2023-01-10
LU, YONG-YAN
Executed: 2023-02-03
CHUNG, MING-HAN
Executed: 2023-03-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Manufacture
Application:
18/158,641 →
Publication:
US 2023/0163197