Patent Assignment
Reel/Frame 062993/0437
Assignment of Assignor's Interest
Recorded: 2023-03-15
Pages: 6
Assignors
KANG, SUNG GU
Executed: 2023-03-02
KIM, JAE CHOON
Executed: 2023-03-02
PARK, HWAN JOO
Executed: 2023-03-02
MUN, SUNG-HO
Executed: 2023-03-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method for Manufacturing the Same
Application:
18/184,386 →
Publication:
US 2024/0047290