Patent Assignment
Reel/Frame 063027/0510
Assignment of Assignor's Interest
Recorded: 2023-03-19
Pages: 5
Assignees
BONDTECH CO., LTD.
77, KISSHOIN-ISHIHARANISHI-MACHI, MINAMI-KU, KYOTO-SHI, KYOTO, 601-8366, JAPAN
SUGA, TADATOMO
6-3, HIGASHINAKANO 3-CHOME, NAKANO-KU, TOKYO, 164-0003, JAPAN
Covered Property
(1)
Substrate Bonding Method and Substrate Bonding System