Patent Assignment
Reel/Frame 063028/0974
Assignment of Assignor's Interest
Recorded: 2023-03-20
Pages: 5
Assignors
CHUN, HEE SUN
Executed: 2023-02-16
KIM, JIN WOO
Executed: 2023-02-16
KIM, TAE HYUNG
Executed: 2023-02-16
LEE, HYO JU
Executed: 2023-02-16
YOON, SEOK HYUN
Executed: 2023-02-22
KIM, JEONG RYEOL
Executed: 2023-02-22
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Electronic Component