Patent Assignment
Reel/Frame 063034/0600
Assignment of Assignor's Interest
Recorded: 2023-03-20
Pages: 4
Assignor
CHENG, AN-SHENG
Executed: 2023-02-03
Assignee
GAN SYSTEMS INC.
SUITE 201, 770 PALLADIUM DRIVE, KANATA, K2V 1C8, CANADA
Covered Property
(1)
Embedded Die Packaging of Power Semiconductor Devices
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 20, 2023
From: COATES, STEPHEN
To: GAN SYSTEMS CORP
Reel/Frame 063034/0724 →
Assignment of Assignor's Interest
Mar 20, 2023
From: GAN SYSTEMS CORP
To: GAN SYSTEMS INC.
Reel/Frame 063035/0017 →
Court Order
Aug 23, 2024
From: GAN SYSTEMS INC.
To: INFINEON TECHNOLOGIES CANADA INC.
Reel/Frame 068763/0324 →