Patent Assignment
Reel/Frame 063035/0445
Assignment of Assignor's Interest
Recorded: 2023-03-20
Pages: 2
Assignor
KHALAF, BILAL
Executed: 2023-03-17
Assignee
SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
10951 WHITE ROCK RD., RANCHO CORDOVA, CALIFORNIA, 95670
Covered Property
(1)
Methods and Systems for Controlling Underfill Bleed-Out in Semiconductor Packaging
Application:
18/123,612 →
Publication:
US 2024/0321609