Patent Assignment
Reel/Frame 063038/0502
Assignment of Assignor's Interest
Recorded: 2023-03-20
Pages: 5
Assignors
TEYSSEYRE, JEROME
Executed: 2018-04-24
PAUL, ROVEENDRA
Executed: 2018-04-26
LEE, DUKYONG
Executed: 2018-05-21
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Heat Transfer for Power Modules
Application:
18/186,842 →
Publication:
US 2023/0230895
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 9, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 065402/0293 →
Release of Security Interest in Patents Recorded at Reel 064502, Frame 0293
Nov 14, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065566/0488 →