Patent Assignment
Reel/Frame 063058/0140
Assignment of Assignor's Interest
Recorded: 2023-03-22
Pages: 3
Assignors
LEE, YU CHEN
Executed: 2023-03-21
WANG, CHIN-HUA
Executed: 2023-03-21
JENG, SHIN-PUU
Executed: 2023-03-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Reinforcement Structures for Chip-Interposer and Interposer-Substrate Bonding and Methods of Making the Same
Application:
18/124,752 →
Publication:
US 2024/0321772