Patent Assignment
Reel/Frame 063072/0001
Change of Name
Recorded: 2023-03-13
Pages: 24
Assignor
SHOWA DENKO PACKAGING CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC PACKAGING CORPORATION
60 KIYOSAKICHO, HIKONE-SHI, SHIGA, 529-1156, JAPAN
Covered Properties
(2)
Chassis for Small Electronic Device and Method for Forming Same, and Rolled Aluminum Alloy Laminated Sheet Material for Chassis for Small Electronic Device
Shaped Container for Storing Fat-Containing Food and Package
Application:
17/066,441 →
Publication:
US 2021/0107248
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.