Patent Assignment
Reel/Frame 063075/0969
Assignment of Assignor's Interest
Recorded: 2023-03-23
Pages: 2
Assignor
ISHIDA, ATSUSHI
Executed: 2023-03-21
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Method for Manufacturing Printed Wiring Board and Printed Wiring Board