Patent Assignment
Reel/Frame 063087/0571
Assignment of Assignor's Interest
Recorded: 2023-03-24
Pages: 7
Assignors
CHOI, EUNSUK
Executed: 2023-03-09
KIM, YERAM
Executed: 2023-03-09
KIM, SIWOO
Executed: 2023-03-09
KIM, JINAH
Executed: 2023-03-09
KIM, HYONGSOO
Executed: 2023-03-09
LEE, SEONBAEK
Executed: 2023-03-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same