Patent Assignment
Reel/Frame 063089/0465
Assignment of Assignor's Interest
Recorded: 2023-03-24
Pages: 3
Assignors
KUO, FU-CHIANG
Executed: 2022-08-02
CHEN, YU-HAN
Executed: 2023-03-20
LO, CHENG-WEI
Executed: 2022-08-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Deep Trench Capacitor Structure and Method for Forming the Same