Patent Assignment
Reel/Frame 063092/0243
Assignment of Assignor's Interest
Recorded: 2023-03-24
Pages: 5
Assignor
ISHIZAKA, TADAHIRO
Executed: 2020-07-01
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 1076325, JAPAN
Covered Property
(1)
Ruthenium Film Forming Method and Substrate Processing System