Patent Assignment
Reel/Frame 063120/0349
Confidentiality and Intellectual Property Agreement
Recorded: 2023-03-20
Pages: 11
Assignor
LIN, JING CHENG
Executed: 2018-01-02
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Semiconductor Assemblies Including Combination Memory and Methods of Manufacturing the Same