Patent Assignment
Reel/Frame 063125/0529
Assignment of Assignor's Interest
Recorded: 2023-03-28
Pages: 5
Assignors
SON, MYUNG CHAN
Executed: 2023-01-11
PARK, YONG
Executed: 2023-01-11
LEE, JONG HO
Executed: 2023-01-11
LEE, EUN JUNG
Executed: 2023-01-11
PARK, JUNG TAE
Executed: 2023-01-11
KIM, MIN WOO
Executed: 2023-01-11
LEE, JI HYEON
Executed: 2023-01-11
KIM, SUN MI
Executed: 2023-01-12
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Multilayer Electronic Component
Application:
18/127,234 →
Publication:
US 2024/0071689