Patent Assignment
Reel/Frame 063127/0135
Assignment of Assignor's Interest
Recorded: 2023-03-28
Pages: 4
Assignors
CHEN, CHIH-LIANG
Executed: 2016-10-25
LAI, CHIH-MING
Executed: 2016-11-01
YOUNG, CHARLES CHEW-YUEN
Executed: 2016-11-03
TSENG, CHIN-YUAN
Executed: 2016-11-01
TZENG, JIANN-TYNG
Executed: 2016-10-28
SIO, KAM-TOU
Executed: 2016-11-03
LIU, RU-GUN
Executed: 2016-11-02
LIN, WEI-LIANG
Executed: 2016-11-01
CHOU, L. C.
Executed: 2016-10-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Making Semiconductor Device Which Includes Fins
Application:
18/190,670 →
Publication:
US 2023/0247817