Patent Assignment
Reel/Frame 063127/0142
Assignment of Assignor's Interest
Recorded: 2023-03-28
Pages: 4
Assignors
KU, CHUN-YAO
Executed: 2020-07-07
CHEN, WEN-HAO
Executed: 2020-07-07
CHEN, KUAN-TING
Executed: 2020-07-07
YU, MING-TAO
Executed: 2020-07-07
CHANG, JYUN-HAO
Executed: 2021-01-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit and Method of Forming the Same