Patent Assignment
Reel/Frame 063136/0340
Assignment of Assignor's Interest
Recorded: 2023-03-28
Pages: 9
Assignors
CHANG, CHENG-WEI
Executed: 2022-12-23
CHANG, CHIEN
Executed: 2022-12-25
LIN, KAN-JU
Executed: 2022-12-25
CHIEN, HARRY
Executed: 2022-12-25
LIANG, SHUEN-SHIN
Executed: 2022-12-28
CHU, CHIA-HUNG
Executed: 2022-12-26
WANG, SUNG-LI
Executed: 2022-12-25
MORE, SHAHAJI B.
Executed: 2022-12-26
PAI, YUEH-CHING
Executed: 2022-12-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Void-Free Conductive Contact Formation
Application:
18/191,750 →
Publication:
US 2024/0021687