Patent Assignment
Reel/Frame 063137/0032
Assignment of Assignor's Interest
Recorded: 2023-03-28
Pages: 7
Assignors
LEE, JUNGA
Executed: 2023-02-28
KIM, YOUNGJA
Executed: 2023-02-28
KIM, HYUNKI
Executed: 2023-02-28
LEE, YOUNGMIN
Executed: 2023-02-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Solder Reflow Apparatus and Method of Manufacturing an Electronic Device