Patent Assignment
Reel/Frame 063152/0224
Assignment of Assignor's Interest
Recorded: 2023-03-29
Pages: 2
Assignor
YAMADA, TAKAFUMI
Executed: 2023-03-06
Assignee
FUJI ELECTRIC CO., LTD.
1-1, TANABESHINDEN, KAWASAKI-KU, KAWASAKI-SHI, KANAGAWA, 210-9530, JAPAN
Covered Property
(1)
Semiconductor Device with Sealing Surfaces of Different Height and Semiconductor Device Manufacturing Method