Patent Assignment
Reel/Frame 063184/0538
Assignment of Assignor's Interest
Recorded: 2023-03-31
Pages: 4
Assignors
LIN, CHUN-LIANG
Executed: 2023-03-23
HU, CHENMING
Executed: 2023-03-23
CHEN, WAN-HSIN
Executed: 2023-03-23
KAWAKAMI, NAOYA
Executed: 2023-03-23
Assignees
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
NATIONAL YANG MING CHIAO TUNG UNIVERSITY
NO.1001, DAXUE RD., EAST DIST., HSINCHU CITY, 300, TAIWAN
Covered Property
(1)
Semiconductor Structure and Manufacturing Method Thereof
Application:
18/193,041 →
Publication:
US 2024/0332013