Patent Assignment
Reel/Frame 063185/0819
Assignment of Assignor's Interest
Recorded: 2023-03-31
Pages: 6
Assignors
YONETSU, MAKI
Executed: 2023-02-02
SUENAGA, SEIICHI
Executed: 2022-11-25
FUJISAWA, SACHIKO
Executed: 2022-11-25
SANO, TAKASHI
Executed: 2022-11-25
Assignees
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
TOSHIBA MATERIALS CO., LTD.
8, SHINSUGITA-CHO, ISOGO-KU, YOKOHAMA-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Bonded Body, Ceramic Copper Circuit Substrate, and Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment
Feb 19, 2026
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MATERIALS CO. LTD.
Reel/Frame 074940/0511 →
Change of Name
Feb 19, 2026
From: TOSHIBA MATERIALS CO. LTD.
To: NITERRA MATERIALS CO., LTD.
Reel/Frame 074941/0803 →
Change of Address
Feb 19, 2026
From: KABUSHIKI KAISHA TOSHIBA
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 074941/0846 →