Patent Assignment
Reel/Frame 063187/0487
Assignment of Assignor's Interest
Recorded: 2023-03-31
Pages: 4
Assignors
HSIEH, PING-YIN
Executed: 2022-12-04
SHIH, YING-CHING
Executed: 2022-12-04
CHENG, LI-HUI
Executed: 2022-12-04
WANG, PU
Executed: 2022-12-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly
Application:
18/193,932 →
Publication:
US 2024/0332113