Patent Assignment
Reel/Frame 063193/0263
Assignment of Assignor's Interest
Recorded: 2023-03-31
Pages: 17
Assignors
KURIBAYASHI, KOEI
Executed: 2021-01-18
OGAWA, ARITO
Executed: 2021-01-18
SEINO, ATSURO
Executed: 2021-01-18
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Method of Processing Substrate, Method of Manufacturing Semiconductor Device, Recording Medium, and Substrate Processing Apparatus