Patent Assignment
Reel/Frame 063216/0492
Change of Name
Recorded: 2023-04-04
Pages: 11
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Polishing Liquid, Polishing Liquid Set and Polishing Method
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 25, 2020
From: HANANO, MASAYUKI; TAKIZAWA, TOSHIO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 052226/0257 →
Change of Name
Jan 25, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062508/0628 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →