Patent Assignment
Reel/Frame 063224/0428
Assignment of Assignor's Interest
Recorded: 2023-04-04
Pages: 3
Assignee
ASAHI KASEI MICRODEVICES CORPORATION
1-1-2 YURAKUCHO, CHIYODA-KU, TOKYO, 100-0006, JAPAN
Covered Property
(1)
Semiconductor Package and Drive Apparatus