Patent Assignment
Reel/Frame 063229/0409
Assignment of Assignor's Interest
Recorded: 2023-04-05
Pages: 6
Assignors
JANG, MINHO
Executed: 2023-03-23
KWON, DOOWON
Executed: 2023-03-23
LIM, KYUNGTAE
Executed: 2023-03-23
KIM, DONGHYUN
Executed: 2023-03-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Highly Integrated Image Sensors Using Inter-Substrate Wiring Structures
Application:
18/295,966 →
Publication:
US 2024/0014243