Patent Assignment
Reel/Frame 063236/0390
Assignment of Assignor's Interest
Recorded: 2023-04-05
Pages: 10
Assignors
IM, SEUNGWON
Executed: 2023-03-28
JEON, OSEOB
Executed: 2023-04-03
KANG, DONGWOOK
Executed: 2023-03-28
KO, YOUNGSUN
Executed: 2023-03-28
KIM, JEUNGDAE
Executed: 2023-03-28
YUN, CHANGSUN
Executed: 2023-03-28
KIM, JIHWAN
Executed: 2023-04-04
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Transfer Molded Power Modules and Methods of Manufacture
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 9, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 065402/0293 →
Release of Security Interest in Patents Recorded at Reel 064502, Frame 0293
Nov 14, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065566/0488 →