Patent Assignment
Reel/Frame 063240/0584
Assignment of Assignor's Interest
Recorded: 2023-04-06
Pages: 3
Assignor
HIRATA, KAZUYA
Executed: 2023-03-17
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Wafer Production System and Wafer Manufacturing Method