Patent Assignment
Reel/Frame 063254/0309
Assignment of Assignor's Interest
Recorded: 2023-04-07
Pages: 7
Assignors
KIM, BYONGJU
Executed: 2023-02-15
CHOI, DONGSUNG
Executed: 2023-02-15
PARK, WONJUN
Executed: 2023-02-15
LEE, DONGHWA
Executed: 2023-02-16
JUNG, JAEMIN
Executed: 2023-02-16
CHEON, CHANGHEON
Executed: 2023-02-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Manufacturing Semiconductor Devices