Patent Assignment
Reel/Frame 063259/0899
Assignment of Assignor's Interest
Recorded: 2023-04-07
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Semiconductor Package
Application:
18/297,249 →
Publication:
US 2024/0088005