Patent Assignment
Reel/Frame 063264/0829
Assignment of Assignor's Interest
Recorded: 2023-04-07
Pages: 5
Assignors
YUN, SU YUN
Executed: 2023-03-09
CHOI, HONG JE
Executed: 2023-03-09
HAN, JI HYE
Executed: 2023-03-09
KANG, BYUNG WOO
Executed: 2023-03-09
PARK, HYE JIN
Executed: 2023-03-09
LEE, SANG WOOK
Executed: 2023-03-09
KIM, JUNG MIN
Executed: 2023-03-09
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Electronic Component