Patent Assignment
Reel/Frame 063272/0081
Assignment of Assignor's Interest
Recorded: 2023-04-10
Pages: 6
Assignors
CHAN, BOON TEIK
Executed: 2022-11-14
RADISIC, DUNJA
Executed: 2022-12-08
CHEHAB, BILAL
Executed: 2022-11-14
Assignee
IMEC VZW
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
Covered Property
(1)
Conductive via formation connecting transistor structures in an integrated circuit